2358976 - Defining the padding mechanism with EdiSecurityModule | SAP Knowledge Base Article

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2358976 - Defining the padding mechanism with EdiSecurityModule

Symptom

You're sending signed EANCOM document and would like to configure certain value of padding mechanism according to EANCOM standard.


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Environment

  • SAP Process Integration, business-to-business add-on

Keywords

EdiSecurityModule, EANCOM, AUTACK, padding mechanism, Process Integration 7.0, PI 7.0, PI 7.01, PI 7.02, Process Integration 7.10, PI 7.10, Process Integration 7.11, PI 7.11, Process Integration 7.30, PI 7.30, Process Integration 7.31, PI 7.31, Process Orchestration 7.4, PI 7.4, PO 7.4, Process Orchestration 7.5, PI 7.5, PO 7.5, XI, AEX , KBA , BC-XI-CON-B2B-MOD , EDI Modules - Plain Text, Archiving, etc. , How To

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