SAP Knowledge Base Article - Preview

2305918 - SMP 2.3 SP08 HWC file packaging for Android OS is different compared to 2.3.7 and earlier versions

Symptom

  • After unzipping the SMP 2.3 SP08 HWC sdk customers will see the file structure is not the Eclipse based project structure of the previous SP07 HWC.


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Environment

SMP 2.3 SP08 HWC SDK for Android

Product

SAP Mobile Platform 2.3 ; SAP Mobile Platform SDK 2.3

Keywords

Android  SDK HWC SMP eclipse , KBA , MOB-SUP-SDK , Mobile SDK , Problem

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